APEL Postforming Glue

APEL Postforming Glue is a water based PVAc. glue that is used to bond laminate papers to MDF or chipboards.

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Χαρακτηριστικά

• The glue will not debond under high temperatures in application. • . No colorization, charring or fading in application. • Strong physical resistance against impacts aftercured. • Semi-transparent color • İt is resistant to press processing at very high temperatures. • It contains special protectants against bacterial spoilage and mold.

Πεδία Χρήσης

• Glue is used to bond HPL and CPL laminaton papers under high heat to MDF, chipboard and solid wood for kitchen counter productions Suitable for roller press applications. Suitable for cold press lamination.